Research on Full-Field Deformation Testing of 3D Printed Bridges Based on DIC Technology

Authors

  • Chenyang Su Beijing City University, Beijing, 101309, China
  • Huiru Huang Beijing City University, Beijing, 101309, China
  • Xia Guo Institute of Analysis and Testing, Beijing Academy of Science and Technology(Beijing Center for Physical & Chemical Analysis), Beijing, 100089, China

Abstract

With the acceleration of urbanization, traditional bridge construction methods face dual challenges of efficiency and cost. 3D printing technology offers an innovative solution for bridge engineering. This study combines Digital Image Correlation (DIC) technology with numerical simulation methods to systematically analyze the full-field deformation characteristics of double-arch and four-arch 3D printed bridges under different load conditions. By comparing physical loading tests with finite element simulations, this research reveals the influence patterns of aperture geometric features on structural stiffness, stress distribution, and bearing capacity.

Downloads

Published

2025-08-15

Issue

Section

Articles